Base material: FR4-S1000-2M
Plate thickness: 1.6mm
Number of layers: double-sided board
Process: lead-free tin spraying
Minimum drilling hole: 0.25mm
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Features: Strict appearance requirements, line width and distance of 4mil
Substrate: FR4
Plate thickness: 1.6mm
Number of layers: double-sided board
Process: lead-free tin spraying
Minimum drilling hole: 0.3mm
Minimum line width: 0.16mm
Minimum line spacing: 0.16mm
Features: High current, high reliability, thick copper plate
Base material: FR4-S1000-2M
Plate thickness: 1.6mm
Number of layers: four layer board
Process: Sinking Gold Plate
Minimum drilling hole: 0.25mm
Minimum line width: 0.16mm
Minimum line spacing: 0.16mm
Features: Gold finger, impedance board, gold finger requires beveled edges
Base material: FR4-S1000-2M
Plate thickness: 1.6mm
Number of layers: Six layers of board
Craft: Sinking Gold+Gold Fingers
Minimum drilling hole: 0.25mm
Minimum line width: 0.1mm
Minimum line spacing: 0.1mm
Features: Hole copper 25um, thick copper plate, internal and external 4oz, blind buried hole plate
PRESSING
drill
PTH
Lamination
plating
etch
develop
Resistance welding
Silk screen printing
Surface Treatment
forming
Flying Needle Test
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